Intel to Offer Optional Low-Pressure ILM on LGA1851 for ArrowLake-S, with Implications for CPU Performance

TapTechNews July 4th news, according to X platform insider Jaykihn (@jaykihn0), Intel will offer an optional low-pressure ILM (Independent Mounting Device, commonly known as buckle) on the LGA1851 platform for ArrowLake-S processors.

Intel's ILM used on the current LGA1700 platform has relatively high pressure, which will cause a certain bending of the CPU IHS (Integrated Heat Sink, commonly known as top cover) after long-term use, affecting the fit of the heat sink and thereby reducing the heat dissipation effect.

However, Intel does not recommend that LGA1700 platform users switch to third-party buckles, because the slight bending is within the design expectation and third-party buckles will also result in warranty invalidation.

Intel will introduce two ILM solutions on the LGA1851, the default ILM is similar to that on the LGA1700, with an angle of 2°, still exerting relatively high pressure on the IHS, but having the widest compatibility with the CPU heat sink.

The newly launched RL (ReducedLoad)-ILM low-pressure buckle has no angle, which can improve the CPU heat dissipation performance while not affecting the product warranty.

However, RL-ILM also means that users need to use a heat sink with at least 35 pounds of loading force (TapTechNews note: approximately 155.7 Newtons) in配套 to ensure normal use.

The source also said that the RL-ILM is less than $1 more expensive than the default ILM (TapTechNews note: currently about 7.289 yuan).

Which ILM will be used by the motherboard is to be determined by the manufacturer.

Related reading:

LGA1700 Buckle Causing Intel's 12th Gen Core Processors to Bend: Players Fine-Tune the Gasket, Reducing the Baking Machine Temperature by 5°C.

Intel Responds to LGA1700 Motherboard Will Bend the 12th Generation AlderLake CPU, Saying 'It's Within the Expectation and Won't Cause Major Problems'.