TapTechNews July 3rd news, SeaSonic recently released the FOCUS V4 power supply, equipped with the brand-new OptiSink high-efficiency heat dissipation technology.
SeaSonic OptiSink consists of multiple heat dissipation optimizations: moving the key heat-generating components to the front of the PCB to reduce heat accumulation; mounting the MOS vertically on a vertical small card and using thermal paste to improve the heat transfer efficiency; attaching the MOS directly to the PCB to utilize the copper foil of the PCB for rapid heat dissipation.
SeaSonic claims that the OptiSink technology can increase the heat dissipation space by 48% and the thermal conductivity coefficient is even increased by 8 times.
In addition, SeaSonic also adds heat transfer paths and holes in the PCB of the FOCUS V4 power supply to improve the heat dissipation efficiency of the MOS; and improves the stability and reliability of the power supply through the SMD front-striking process.
SeaSonic has currently launched the gold conversion efficiency version of the FOCUS V4 power supply (TapTechNews note: that is, the GX series), including three power levels of 750/850/1000 W, all of which have a ten-year warranty.
These three power supplies adopt an active PFC + full-bridge LLC + synchronous rectification + DC-DC conversion scheme, which conforms to the Intel ATX3.1 standard, and the overall power supply can withstand 230+% instantaneous peak power consumption, which is higher than the 200% specified in the ATX3.1 standard.
This series of power supplies adopts a full modular design, is standard with textured modular lines, and is equipped with a native 12V-2×6 graphics card power supply interface, which can withstand a 300% instantaneous power consumption load of the graphics card.
In addition, these power supplies house a 135mm FDB bearing fan that supports low-load shutdown within the standard ATX specification, which is more excellent than the 120mm fan commonly used in standard ATX power supplies.