Jingsheng Mechanical & Electrical's New Breakthrough in Ultra-Thin Wafer Technology

TapTechNews August 10th news, Ultra-thin wafers have become one of the key materials for the current development of the semiconductor industry due to their high integration, low power consumption, and excellent performance.

As the semiconductor process enters the 2.5D/3D era, the thickness of wafers is getting thinner and thinner, posing extremely high requirements on equipment accuracy and process control.

Jingsheng Mechanical & Electrical officially announced today that the new WGP12T thinning and polishing equipment developed by its research institute has successfully achieved stable processing of 12-inch 30 µm ultra-thin wafers (TapTechNews note: The thickness of a 12-inch wafer is usually about 775 µm).

Allegedly, the successful breakthrough of this technology marks an important step forward for Jingsheng Mechanical & Electrical in the field of semiconductor equipment manufacturing, providing strong support for the technological progress and independent controllability of the Chinese semiconductor industry.

Jingsheng Mechanical & Electrical stated that the R & D team has solved the problems such as deformation, cracks, and contamination that occurred during the thinning and processing of ultra-thin wafers, and truly achieved the efficient and stable processing technology of 30 µm ultra-thin wafers. This breakthrough in the industry-leading ultra-thin wafer processing technology again will provide a more advanced and efficient wafer processing solution for the semiconductor industry in our country.