Loongson中科 3C6000 Series Processor Update

TapTechNews June 24th, it is reported on the Shanghai Stock Exchange E-interaction platform. Today, when answering investors' questions, Loongson中科 disclosed that the prototype of the Loongson中科 3C6000 series processor has returned the wafer and is in the testing process, generally meeting expectations, and it is planned to be released in the fourth quarter..

According to TapTechNews' previous reports, the Loongson 3C6000 server chip adopts a single silicon wafer with 16 cores and 32 threads, and the general processing performance is significantly improved. The memory uses DDR4-3200×4 and supports LS3D6000 dual silicon wafers with 32 cores and 64 threads, LS3E6000 four silicon wafers with 64 cores and 128 threads, and supports GPGPU and various accelerator extensions.

In addition, the Loongson 3C6000 realizes on-chip interconnection for the first time through the Loongson Coherent Link technology. The Loongson Coherent Link technology is benchmarked against nVLink and CXL and can achieve the connection of Chiplet (small chips, chiplets).