NVIDIA's GB200 Series AI Chips in High Demand, Back-End Packaging and Testing Orders Surge

TapTechNews June 24, according to the Taiwan media Economic Daily News, NVIDIA's brand-new GB200 series AI chips are in great demand. After NVIDIA increased its advanced process wafer input to TSMC, it also placed follow-up orders with back-end packaging and testing factories. The relevant order volume of ASE and King Yuan in the fourth quarter will double quarter-on-quarter.

According to TapTechNews' previous report, the GB200 chip was released on March 19, which is composed of two B200 Blackwell GPUs and one Arm-based Grace CPU. The performance of reasoning large language models is 30 times higher than that of H100, and the cost and energy consumption are reduced to one twenty-fifth.

Siliconware under ASE has a close relationship with NVIDIA. It not only undertakes the oS segment process of TSMC's CoWoS advanced packaging, but also arranges testing capacity in the Zhongke factory to meet NVIDIA's one-stop production service from the wafer back-end to the packaging and testing segment.

King Yuan Electric responded that the current capacity utilization rate is indeed high, but it will not comment on a single customer. Sources disclosed that the new orders from NVIDIA to King Yuan Electric are fully booked, and King Yuan Electric has made an all-round mobilization internally to shift more capacity to meet NVIDIA's needs.

In the industry analysis, the test process of the GB200 and B series AI chips is much longer than that of the previous H series, and it must go through four consecutive procedures, including final test, Burn-in aging test, and then back to the final test, and finally the SLT system-level test.

TrendForce released a report stating that the supply chain is optimistic that the shipment volume of GB200 AI chips will exceed one million in 2025, and due to the significant increase in the testing time, ASE and King Yuan Electric will become the two big winners in the later packaging and testing stage.