SK Hynix Predicts 70% CAGR for HBM Memory with Future Prospects

TapTechNews July 5th news, according to South Korean media ETNews report, Moon Ki-ill, vice president of SK Hynix and head of packaging technology development, said at the event held in Seoul yesterday (4th) that the compound annual growth rate (CAGR) of HBM memory is expected to reach 70%.

Moon Ki-ill stated that market research firm TrendForce had believed that the CAGR of the HBM memory market from 2021 to 2027 would be 26.4%, but the demand from downstream customers far exceeds the expectations of third-party institutions.

According to TapTechNews' previous reports, the three major DRAM enterprises led by SK Hynix have basically sold out the HBM supply in 2025.

Moon Ki-ill also mentioned that HBM is currently mainly used in AI accelerators, but is expected to penetrate into the consumer market represented by PCs and mobile devices after the price drops in the future.

AMD had launched several high-end consumer-level graphics cards with HBM memory in the GCN architecture generation (TapTechNews note: such as RXVega64, R9FuryX, etc.), but then HBM withdrew from the consumer-level field of vision.

Moon Ki-ill said: SK Hynix is preparing hybrid bonding technology for the production of 16 and 20-layer stacked HBM memory, which will make them more competitive in price.