Hymson's MicroLED Pilot Line Achieves High Yield and Advanced Technologies

TapTechNews August 1st news, TapTechNews learned from the official public account of Hymson that its first MicroLED pilot line has been successfully shipped, covering equipment such as MicroLED massive transfer, MicroLED massive welding, and MicroLED laser repair, and has completed the in-factory FAT acceptance. The production line efficiency reaches 25-100 kk/h, and the process yield is above 99.99%, realizing the application requirements of MicroLED chips with a size of ≤50 μm.

The MicroLED chip massive transfer/single-point repair transfer solution adopts a fully modular compatible design throughout, cooperating with intelligent removal and repair equipment to achieve the integration of the entire manufacturing process and has the production advantage of mass production.

Hymson applies an infrared light source with a homogenization of more than 95%, combined with a high-precision temperature control system, rapid visual alignment, and self-developed AI algorithms to achieve massive bonding of chips with large area, high efficiency, and high reliability.

At present, the MicroLED massive welding equipment has achieved the RGB three-color welding process for substrates larger than 12 inches, and the yield is as high as 99.99% or more (excluding abnormalities such as incoming chips).

In view of the defects generated in the MicroLED process, Hymson conducts the removal of the glue layer and chips and the repair of the solder pad with a flatness of hundreds of nanometers to facilitate the subsequent repair process. After being repaired by this equipment, combined with the subsequent core-filling and welding processes, the panel lighting yield can reach 99.9999%.