Samsung Electronics to Complete FOWPL-HPB Packaging Tech Development

TapTechNews July 3rd news, according to the report of the South Korean media TheElec, the AVP advanced packaging business team of Samsung Electronics aims to complete the development and mass production preparation of a packaging technology named  FOWPL-HPB for mobile processors by the fourth quarter of this year.

With the increase of on-device generative AI demand, how to solve the overheating that affects the performance of mobile processors has become an important issue.

Samsung Electronics has introduced the FOWPL fan-out wafer-level packaging technology on the Exynos2400, and the heat dissipation ability of the processor has increased by 23%. Industry insiders expect that FOWPL-HPB will also be率先 used on Samsung Electronics' own Exynos2500 processor first.

HPB, which stands for HeatPathBlock, is a heat dissipation technology that has been used in servers and PCs. Due to the relatively thin thickness of mobile phones, HPB has not been applied on mobile SoCs before.

Unlike the VC vapor chamber heat dissipation that covers the mobile processor and surrounding areas, HPB focuses on improving the heat dissipation ability of the processor. It is located on top of the mobile SoC, and the memory will be installed next to the HPB..

The South Korean media also mentioned that Samsung Electronics will further develop on the basis of FOWPL-HPB next year and aims to launch a new FOWLP-SiP (TapTechNews note: System-in-Package) technology that supports multi-chips and HPB by the fourth quarter of 2025.

Samsung Electronics will also improve the heat dissipation performance of mobile processors by changing the packaging materials such as underfill.