SK Hynix's Vice President on Chiplet Technology and Future Outlook

TapTechNews August 27th news, according to the comprehensive reports of Korean media TheElec and ZDNetKorea, SK Hynix vice president (also known as managing director) Moon Ki-il said at an academic conference yesterday local time in Korea that the Chiplet technology will be applied to DRAM and NAND products in 2 to 3 years.

Not all the controller functions of storage products need to use advanced processes. By adopting the Chiplet design, the function modules with lower process requirements can be separated onto the mature process chips with lower costs, greatly reducing the cost while not affecting the function realization.

SK Hynix is developing the Chiplet technology internally. The company has not only joined the UCIe industry alliance, but also applied for and registered the MOSAIC trademark for Chiplet technology worldwide in 2023.

Moon Ki-il also said at this conference that the emerging process hybrid bonding used to connect the bare dies of each layer of HBM memory currently faces many challenges, but this process will still be the future direction.

Hybrid bonding puts forward higher precision requirements for the CMP (TapTechNews note: chemical mechanical polishing) processing step; in addition, the debris contamination problem caused by packaging processing also has a significant impact on the yield of HBM memory.