TapTechNews June 3rd news, water cooling solution provider Asetek announced a collaboration with metal 3D printing company Fabric8Labs to launch a new cold head optimized by AI, which will be exhibited at the ASUS ROG booth of Computex 2024 Taipei International Computer Show.
Compared with previous generations of water cooling solutions, the AI-optimized cold head uses artificial intelligence and ECAM additive manufacturing technology to improve the heat dissipation performance in an 'unprecedented' way by optimizing fluid dynamics.
According to the introduction, the official uses a complex AI simulation tool to construct the entire architecture of the cold head, and its fins are different in design and can only be manufactured using 3D printing process.
TapTechNews noted that compared with Asetek's eighth-generation solution, the initial AI-optimized cold head design can reduce the thermal resistance by 2.3 °C per 100 watts.
Asetek announced that it will showcase the new AI-optimized water cooling head at the booth of its DIY core partner ASUS ROG, and has not yet announced the specific launch time of the terminal product.