Nvidia's Blackwell GB200 Server and New Packaging Technology

TapTechNews May 23rd news, it is said that the estimated shipping volume of Nvidia's Blackwell GB200 artificial intelligence server is 500,000 pieces in 2024, and will reach 2 million pieces in 2025, and in addition, Nvidia is exploring to adopt a brand-new packaging technology.

Nvidia's Blackwell GB200 capacity is currently being affected by HBM and CoWoS packaging capacity. According to the Economic Daily report, Nvidia's GB200 AI chip will adopt the panel-level fan-out packaging (panel-level fan-out packaging, abbreviated as PFLO) plan, and it is planned to implement this measure at the end of 2025 or 2026.

TapTechNews note: The PFLO scheme is to integrate multiple independent integrated circuits on different silicon wafers, use materials such as laminates or glass instead of silicon as carriers, and use Redistribution Layers (RDL) formation and other technologies to achieve.

At present, there is no intuitive data to compare which is better between PFLO scheme and CoWoS scheme. PFLO is comparable or even better than CoWoS in terms of performance and scalability.

The suppliers of the new packaging standard are still very limited at present, and Lixco and Innolux are competing for Nvidia's orders. In addition, Nvidia is expected to ship 420,000 Blackwell GB200 in the second half of 2024, while the production volume next year is expected to be between 1.5 million and 2 million units.