#Packaging Technology#

Samsung to Launch SAINT-D Technology for HBM Memory Integration
Samsung Electronics is set to introduce SAINT-D to integrate HBM memory with processor chips, which could change the game in the AI semiconductor field and drive business growth.
Sophia·

Nvidia's Blackwell GB200 Server and New Packaging Technology
Nvidia's Blackwell GB200 server's shipping volume and new packaging technology details.
Nathan·