Siemens and Foxconn Sign MOU to Create Seamless Engineering and Manufacturing Ecosystem

TapTechNews reported on May 15 that Siemens recently signed a memorandum of cooperation with Foxconn Technology Group (Foxconn). Through this strategic cooperation, Siemens and Foxconn will work together to create a scalable and seamlessly integrated engineering and manufacturing ecosystem.

The agreement clearly defines that the two parties will cooperate in multiple areas to further enhance Foxconn's level of production automation, including electronic manufacturing services (EMS), innovative business models in the electric vehicle field, and contract design and manufacturing services (CDMS).

By applying Siemens' factory automation solutions and industrial software portfolio, the two parties will explore more possibilities for the future factory. The comprehensive software and solution suite in the open digital business platform Siemens Xcelerator will also play a key role in optimizing Foxconn's engineering and manufacturing workflows, promoting operational efficiency and flexibility enhancement.

In addition, through this cooperation, Siemens will help Foxconn further optimize the production process, reduce energy consumption and carbon emissions, and accelerate sustainable development. The two parties will create a monitoring mechanism for carbon emissions in the production process by applying digital solutions and expertise, driving the electronic manufacturing industry to accelerate green transformation.

Key points attached to TapTechNews are as follows:

- The two parties signed a memorandum of cooperation (MoU) to work together to fulfill sustainable development commitments

- Jointly define future factory and manufacturing process standards

- Use innovative technologies to promote the rapid advancement of the information communication and electric vehicle industries

- Through the open digital business platform Siemens Xcelerator, help Foxconn enhance operational efficiency and flexibility

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