Micron's HBM3E Memory Encounters Defects, Affecting Production and Supply to NVIDIA

TapTechNews July 12th, according to ZDNetKorea, a South Korean media, Micron's HBM3E memory encountered packaging defects last (6) month, causing heating issues and affecting the mass production process.

Micron announced the mass production of 1β-based HBM3E memory on February 26, 2024, and began to supply to NVIDIA for the H200 AI GPU starting from the second quarter.

Moreover, according to the Taiwanese media Commercial Times, NVIDIA's H200 chip entered the mass production stage in the second half of the second quarter, and it is expected to start large-scale delivery in the third quarter.

The South Korean media stated that since the problem occurred at the 2.5D packaging level rather than the HBM product itself, Micron should not bear much responsibility in this defect.

Some analysts believe that the problem with Micron's HBM3E memory is caused by the wrong materials used by TSMC in the packaging process.

Micron stated in the third quarter fiscal year 2024 (as of May 30 this year) financial report that HBM3E memory has generated more than 100 million US dollars (TapTechNews note: currently about 727 million yuan) in revenue for Micron in the previous fiscal quarter, and the related revenue will further increase in the future.