Samsung Electronics Wins PreferredNetworks' Order for AI Semiconductor Solution

TapTechNews July 9th news, Samsung Electronics today announced that it has won the favor of the Japanese AI startup PreferredNetworks and will provide the latter with a turnkey semiconductor solution of Interposer-CubeS (I-CubeS) based on the 2nm GAA process and 2.5D packaging technology (similar to a 'one-stop semiconductor solution').

It is introduced that PreferredNetworks will use Samsung's technology to develop powerful AI accelerator chips to meet the growing computing power demand of generative AI.

Based on this cooperation, Samsung and PreferredNetworks plan to showcase a breakthrough AI chiplet solution for the next-generation data center and generative AI computing market in the future.

TapTechNews learned from Samsung Electronics that its 2.5D packaging technology I-CubeS is a heterogeneous integration packaging technology that can integrate multiple chips into one package, thereby increasing the interconnection speed and reducing the package size.

Junichiro Makino, vice president and chief technology officer (CTO) of the PreferredNetworks' computing architecture department, said, 'We are very pleased to lead the AI accelerator technology with Samsung Electronics using the 2nm GAA process. This solution will strongly support PreferredNetworks' continuous efforts to build energy-efficient and high-performance computing hardware to meet the growing computing power demand of generative AI, especially large language models.'

Taejoong Song, corporate vice president and head of the foundry business development team of Samsung Electronics, said, 'This order is crucial because it validates Samsung's 2nm GAA process and advanced packaging technology as the ideal solution for the next-generation AI accelerator. We are committed to working closely with our customers to ensure the full play of the excellent performance and low power consumption characteristics of our products.'