Samsung to Start Mass Producing 5th Gen 8-Layer HBM3E in Q3 2024

TapTechNews August 1st news, the South Korean media BusinessKorea reported yesterday (July 31st) that in the earnings call of the second quarter of 2024, senior executives of Samsung Company announced: The fifth-generation 8-layer HBM3E product has currently been delivered to customers for evaluation and is planned to start mass production in the third quarter of 2024.

The person in charge of Samsung said:

We have been ready to mass produce the leading 12-layer HBM3E chip in the semiconductor industry, and we will expand the supply according to the demand plans of multiple customers in the second half of this year.

The share of HBM3E chips in our HBM is expected to exceed 10% in the third quarter and is expected to expand rapidly to 60% in the fourth quarter.

Our HBM sales increased by 50% in the second quarter compared to the previous quarter, and it is expected to increase by 3 to 5 times in the second half of the year, and there will be a significant increase of about 2 times every quarter.

As for the sixth-generation HBM4, we are expected to start shipping from the second half of 2025.

We are also developing performance-optimized custom HBM products for customers, and we have begun to discuss detailed specifications with customers.

TapTechNews reported on July 16th that Samsung plans to transfer at least 20-30% of its capacity to HBM, which may lead to further tightness in DRAM supply, and the price of DDR5 in the third quarter may rise.

TrendForce believes that the recovery of regular server demand, combined with the continuous transfer of DRAM manufacturers to HBM, estimates that the average selling price of DRAM in the third quarter will increase by 8-13%.