According to TapTechNews on June 18th, the Taiwan media Electronic Times reported that H3C has cooperated with Foxconn and will build its first overseas factory in Malaysia. The Malaysia factory is planned to start production in September 2024, and in the next 2 to 3 years, H3C will also build factories in the United States, Mexico, and Europe.
Foxconn previously indirectly controlled an 8-inch wafer fab in Malaysia through investment, with a monthly capacity of about 40,000 wafers, and the process nodes are 28nm and 40nm. H3C will leverage Foxconn's chip manufacturing facilities in Malaysia (H3C will leverage Foxconn's chip manufacturing facilities in Malaysia).
In the cooperative project in Malaysia, H3C will utilize its expertise in artificial intelligence, the Internet of Things, cloud computing, big data, and information security to provide comprehensive solutions and services for Malaysia's digital transformation.
H3C has deployed its UIS hyper-converged infrastructure in various major hospitals in Malaysia and supported the hospital data center through the virtualization of the PACS/HIS system, enhancing the digital management, retrieval, distribution, and display of local medical imaging files.
According to TapTechNews' previous report, on May 24th, Unigroup Zhiguang announced to use 2.143 billion US dollars (TapTechNews note: currently about 15.57 billion Chinese yuan) to buy 30% of the equity of H3C. After the completion of the transaction, Unigroup will indirectly hold 81% of the equity of H3C.