GeIL to Present New Storage Products at 2024 Taipei Int'l Computer Show

TapTechNews June 3rd news, storage module company GeIL recently announced that it will participate in the 2024 Taipei International Computer Show and bring a number of new storage products including DDR5 CAMM2 and LPDDR5 LPCAMM2 memory sticks.

GeIL presented the physical design of the CAMM2 memory stick with 16 DDR5 memory chips in the press release and confirmed some information about the next-generation high-speed DDR memory module.

The 'goldfinger' contacts of DDR5 CAMM2 are located on the back of the memory module, and the DRAM chip solder pad can be set on the reverse side of the contacts.

This is different from the DDR5 CAMM1 specification led by Dell, where the back of the 'goldfinger' area is only used for routing. This change helps to increase the storage density.

In addition, as part of the 'foolproof design', DDR5 CAMM2 and LPDDR5 LPCAMM2 adopt different screw fixing holes. TapTechNews observed and compared and found that there are also differences in the contact layout between the two.

Besides the CAMM family, GeIL will also showcase CUDIMM and CSODIMM. These two series of memories are equipped with CKD clock driver chips, and the memory signal integrity is better and the high-frequency stability is more excellent.

GeIL stated that the company will launch CUDIMM and CSODIMM memory sticks supporting the JEDEC 6400 MT/s specification to the market before the end of 2024 and expand to overclocked SKUs.

GeIL will also showcase the TUF ALLIANCE co-branded RGB heat spreader series, including models with or without small cooling fans on the left and right wings.

2024 Taipei International Computer Show special