NVIDIA, TSMC and SK Hynix to Form Triangle Alliance for Next-Gen Tech

TapTechNews July 13th news, according to the report of businesskorea, a South Korean media, NVIDIA, TSMC and SK Hynix will form a triangle alliance to jointly promote the next-generation technologies such as HBM4 to meet the AI era.

SEMI plans to hold the SEMICON event on September 4th this year (its influence can be regarded as the CES exhibition in the semiconductor industry). More than 1000 companies including TSMC will display the latest semiconductor equipment and technologies, promoting cooperation and innovation.

It is expected that the main focus of this conference is the next-generation HBM, especially the revolutionary HBM4 memory, which will open a new era in the market.

TapTechNews quoted the media report that Kim Joo-sun, the president of SK Hynix, will deliver a keynote speech at the CEO summit of this event, which is the first time the company has played such an important role in this event.

The report said that after Kim Joo-sun finishes his speech, he will discuss the cooperation plan of the next-generation high-bandwidth memory (HBM) with the senior management of TSMC; in addition, a roundtable discussion will be held with NVIDIA to further consolidate the triangle alliance among SK Hynix, TSMC and NVIDIA.

The report pointed out that SK Hynix has reached a cooperation with TSMC to jointly design and produce some products of the HBM4 (sixth generation) series and plans to start mass production in 2026; while NVIDIA provides product design.

SK Hynix is also expected to demonstrate the latest research results of HBM4 in this event. After adopting TSMC's advanced process and packaging technology, the power consumption can be reduced by more than 20% compared to the original target.