#TSMC#

TSMC will get over 60 EUV lithography machines. ASML's supply is tight. TSMC's plans detailed.

Google's TensorG5 chip for next year's flagship to be based on TSMC 3nm process, tapeout stage reached, with implications for self-development and memory support. Related reports included.

Samsung Electronics makes progress in semiconductor packaging and leads in PLP field. TSMC's related research and challenges are detailed. Less than 150 characters.

TSMC's Japanese subsidiary JASM begins second wafer fab construction. Learn about details including planned start, investment, capacity and more.

ByteDance teams up with Broadcom to develop 5-nm AI processor, aiming to ensure chip supply and reduce costs, with hundreds of semiconductor-related positions released.

TSMC secures a large order for the next-generation HBM4 interface chip, amid strong AI demand and the race among memory chip makers to develop HBM4.

TSMC is exploring a new advanced chip packaging approach using a rectangular substrate. Report on the details and challenges. 150 characters max.

TSMC starts mass-producing components for Intel's LunarLake and ArrowLake processors. Learn more here.

Samsung is struggling with 3nm yield and energy efficiency, losing orders to TSMC. TSMC gathers most 3nm orders. Market share gap widens.

Kuo Ming-chi reveals Qualcomm's plans for 2025, including a low-cost WoA processor and details about other processors. Less than 150 characters.

TSMC will increase prices for 3/5nm process and packaging. Nvidia agrees to give profit to get more capacity. Capacity gap in advanced packaging. High demand for TSMC.

TSMC's 3nm FinFET process leads the industry, but price hikes due to capacity shortage, with details on technology giants' adoption and wafer cost increase.

In Q1 2024, global top ten foundry output changed. Semiconductor Manufacturing International Corp outperformed, while TSMC and Samsung's situations are also reported.

TSMC's 3nm series process capacity is highly sought after by tech giants, with orders lined up until 2026. Apple's iPhone 16 series is also expected.

TSMC announced its May 2024 revenue and plans for 3nm process and new factories.

ASML delivers High-NA EUV machine to Intel. TSMC's stance changes. Learn about advanced lithography and its impact on chip manufacturing.

Qualcomm is eyeing a dual-source production strategy involving TSMC and Samsung Electronics for its chips. Learn more here.

The new chairman of TSMC, Wei Zhejia, doubts Sam Altman's chip plan. About Altman's rumors and TSMC's responses are covered.

TSMC announces new chairman, discusses wafer prices, competition, technology updates, and AI.

TSMC's chief executive visited ASML and TRUMPF. ASML's HighNA EUV equipment and its price discussed.

Nvidia is expected to launch a Windows on Arm processor using Intel's 3nm process next year, details here.

Google's first truly self-developed chip Tensor G5 will be mass-produced by TSMC for the 2025 Pixel 10 series, with details and evidence.

TSMC to build seven factories in 2024, with significant growth in 3nm capacity and plans for advanced packaging factories.

TSMC's 2nm progress is smooth, with details on future processes and their features.

SMIC jumped to the third-largest foundry globally in the first quarter of 2024. Industry revenue changes and details of major players. Less than 150 characters.

TSMC projects semiconductor business growth, discusses AI impact and different sector performances. 150 characters.

TSMC plans to significantly increase the production capacity of CoWoS and SoIC by the end of 2026, impacting the semiconductor industry.

TSMC begins to use InFO_SoW technology to produce Tesla's Dojo AI training modules, aiming to increase computing power by 40 times by 2027.

Apple's COO Jeff Williams visited TSMC, aiming to secure 2nm capacity for AI chips. TSMC is a key supplier for Apple's processors.

TSMC may use nuclear power to ease electricity pressure, with impacts on electricity price and gross profit margin, while also increasing renewable energy usage.

Apple's COO visited TSMC to discuss AI chip development and more, with plans for future processors.

Samsung Electronics' 8-layer stacked HBM3E memory faces verification challenges with Nvidia, TSMC involved in the process. Differences in testing standards between Samsung and SK Hynix may need adjustment for successful verification.

SoftBank's Arm announces plans to launch AI chip prototype products by spring 2025. Despite strong financial performance, stock prices drop as investor expectations are not met.