Shin-Etsu Chemical Develops New Semiconductor Back-End Manufacturing Equipment

TapTechNews July 11th news, on June 12th, Shin-Etsu Chemical of Japan announced the development of a new type of semiconductor back-end manufacturing equipment that can directly build circuit patterns that meet the requirements of 2.5D advanced packaging integration on the packaging substrate.

This means that the expensive interposer can be completely omitted in the HBM memory integration process, greatly reducing the production cost while also shortening the advanced packaging process.

Shin-Etsu said that this new back-end equipment uses an excimer laser to etch the wiring, and can batch form large-area complex circuit patterns without the need for a lithography process, reaching a fineness that traditional manufacturing routes cannot reach.

Combined with the photomask blanks and special lenses developed by Shin-Etsu Chemical, the new laser back-end manufacturing equipment can process an area of 100mm square or larger at one time.

According to the Nikkei News, Shin-Etsu Chemical aims to mass-produce this equipment in 2028 and strives to achieve an annual sales of 20 to 30 billion yen (TapTechNews note: currently about 135.3 to 202.95 million US dollars).