US Launches Incentive Measure for Advanced Packaging R & D

TapTechNews July 10th news, on July 9th local time, the US Department of Commerce announced the launch of an advanced packaging R & D incentive measure to accelerate the construction of advanced packaging capacity in the United States.

This move is part of the National Advanced Packaging Manufacturing Plan (NAPMP) announced by the US government in 2023.

The US government plans to provide an incentive of no more than 150 million US dollars (TapTechNews note: currently about 1.092 billion Chinese yuan) in the form of bonuses to innovative projects in the advanced packaging field to leverage private sector investment from industry and academia.

These projects need to be related to one or more of the following five R & D fields:

Equipment, tools, processes, process integration;

Power delivery and thermal management;

Connector technology, including photonics and radio frequency;

Chiplet small chip ecosystem;

Collaborative design / electronic design automation (EDA).

The total amount of all bonuses for this incentive measure will reach 1.6 billion US dollars (currently about 11.652 billion Chinese yuan), all from the US Chips and Science Act.

Laurie E. Locascio, Under Secretary of Commerce for Standards and Technology and Director of the National Institute of Standards and Technology, said:

The National Advanced Packaging Manufacturing Plan will drive innovation through strong R & D, enabling the US packaging industry to surpass the world level.

Within ten years, through R & D funded by the US Chips and Science Act, we will create a domestic packaging industry.

In this industry, advanced node chips produced in the US and abroad can be packaged in the US, and innovative designs and architectures can be achieved through leading packaging capabilities.