Apple Again Postpones Adoption of RCC in iPhones

TapTechNews July 17th news, according to the latest news from Apple analyst Ming-Chi Kuo, Apple has once again postponed the plan to adopt the new Resin Coated Copper Foil (RCC) components in the iPhone. This component that can save internal space was originally planned to be used in iPhone 16, then postponed to iPhone 17, and now it has been postponed again.

TapTechNews noticed that Ming-Chi Kuo pointed out last October that RCC can reduce the thickness of the mainboard and save internal space, and because it does not contain fiberglass, the drilling process is easier. However, Apple and its suppliers have been facing challenges in using RCC, mainly due to durability and fragility issues, which is also the reason for this delay.

Ming-Chi Kuo said in a brief update posted on X: Because it cannot meet Apple's high standard requirements for quality, the 2025 new iPhone 17 will not use RCC as the PCB mainboard material.

If Apple eventually uses RCC material for the mainboard of the iPhone, users may not directly notice the change. But this change will free up more space for the internal design of the iPhone, and Apple can use this to create a thinner body or explore other ways to utilize the added space.

It is not yet clear whether Apple will use RCC on the iPhone 18 in 2026 or will further postpone this plan.