Global 300mm Wafer Fab Equipment Spending Outlook from 2025 to 2027
TapTechNews September 27th news, according to the report of the semiconductor industry organization SEMI in California, USA, local time yesterday, the combined expenditure on manufacturing equipment in 300mm (that is, 12 inches) wafer fabs globally from 2025 to 2027 will reach 400 billion US dollars (TapTechNews note: currently about 2.8 trillion Chinese yuan).
Year by year, the 12-inch wafer fab equipment expenditure in 2024 is expected to increase by 4% year-on-year to 993 billion US dollars; by 2025, it will further increase by 24% year-on-year to 1232 billion US dollars, crossing the 100-billion-dollar mark; in 2026, it will be 1362 billion US dollars, with a year-on-year increase of 11%; and in 2027, it will increase by 3% on this basis to 1408 billion US dollars.
SEMI President and CEO Ajit Manocha said:
The expected increase in equipment spending in 300mm wafer fabs worldwide in 2025 lays the foundation for a record three-year semiconductor manufacturing investment.
The global demand for chips is everywhere, which simultaneously drives equipment spending for cutting-edge technologies for AI applications and mature technologies driven by automotive and Internet of Things applications.
From the perspective of market segments, the logic field will occupy the largest share of expenditure in all categories, and the related 12-inch wafer fab investment from 2025 to 2027 can reach 1730 billion US dollars; the second is the storage field, among which the equipment investment of DRAM and 3D NAND can reach more than 75 billion US dollars and more than 450 billion US dollars respectively.
The power-related field occupies the third position in this list, and the cumulative investment in the next three years will exceed 300 billion US dollars, of which compound semiconductors account for nearly half of 140 billion US dollars; the analog/mixed field and the optoelectronic/sensor field rank fourth and fifth with 230 billion US dollars and 128 billion US dollars respectively.
From the regional perspective, the Chinese mainland will still rank first in the investment in manufacturing equipment in 12-inch wafer fabs with a level of cumulatively exceeding 100 billion US dollars in three years, and South Korea ranks second with 810 billion US dollars due to the strong storage cycle and HBM demand.