Samsung Announces AI Solution with Integrated Services

TapTechNews June 13 - Samsung Electronics announced the Samsung AI solution today in Beijing time. This solution integrates Samsung's internal wafer foundry, storage, and advanced packaging services, forming a 'turnkey' AI chip manufacturing platform.

By integrating the unique advantages of each business department, Samsung can provide high-performance, low-power, and high-bandwidth AI chip solutions that can customize chips according to specific customer needs.

The cross-departmental cooperation within Samsung Electronics also simplifies supply chain management (SCM) in the production process, shortens the time to market, and significantly improves the total turnover time by 20%.

At present, Samsung Electronics can provide an overall solution with 2.5D packaging integration between the processor and HBM memory.

TapTechNews learned from official resources that one of the branches of Samsung Electronics' next-generation 3D chip stacking technology, SAINT-D, is currently in the concept verification stage and is about to be launched in the form of a chip, which will realize the vertical integration of HBM memory.

Samsung Electronics also plans to launch a brand-new all-in-one AI solution integrating the CPO co-packaged optical module in 2027, aiming to provide customers with high-speed and low-power interconnection options.