Samsung to Launch SAINT-D Technology for HBM Memory Integration
TapTechNews June 18th, according to the report of the South Korean media Korea Economic Daily, Samsung Electronics will introduce the SAINT-D technology that can 3D integrate HBM memory with the processor chip within this year.
At the same time, the report also pointed out that after its release this year, Samsung is expected to officially apply the SAINT (TapTechNews note: the abbreviation for Samsung Advanced INterconnect Technology) -D technology in the HBM4 memory to be launched next year.
SAINT-D is an advanced 3DIC packaging technology of Samsung Electronics, aiming to vertically integrate logic dies and DRAM memory dies. The report said that the specific implementation way of this technology is to establish a silicon interposer between the processor and the HBM chip.
Samsung Electronics recently stated at the 2024 North America session of the Samsung Foundry Forum that its SAINT-D technology is currently in the concept verification stage.
The South Korean media said that the SAINT-D technology is expected to change the rules of the game in the AI semiconductor field:
At present, the HBM memory and the processor are connected by 2.5D packaging, and there is a certain distance between them, which not only introduces greater transmission latency, but also affects the quality of electrical signals and increases the power consumption of data movement.
And the distance between the SAINT-D technology processor and the HBM memory is reduced to a lower level, which is conducive to the further release of performance potential of the AI accelerator chip.
For Samsung Electronics as a whole, since it can provide the whole-process 'turnkey' service from advanced node foundry, HBM memory production to overall packaging integration, the application of SAINT-D can also drive the development of HBM and foundry businesses.
According to the data of the market research institution MGI, the scale of advanced packaging markets such as SAINT-D will grow from 34.5 billion US dollars in 2023 to 80 billion US dollars.