TSMC's JASM Starts Construction of Second Wafer Fab in Japan

TapTechNews June 26 - Kyodo News Agency of Japan reported today that TSMC's Japanese subsidiary, JASM, has started the construction of the second wafer fab on the east side adjacent to its first wafer fab.

The Japanese media said that the construction stage of the JASM's second wafer fab is expected to start in the second half of 2024 as originally planned.

JASM is controlled by TSMC with the vast majority of the shares, and other shareholders include Japanese companies such as Sony, Denso, and Toyota. The first wafer fab of JASM is located in Kikuyo-cho, Kumamoto-gun, Kyushu, Japan, and was officially completed in February this year, with the capacity of 22/28nm and 12/16nm.

Quoting the words of the Ministry of Economy, Trade and Industry of Japan, the report said that the planned land area of the wafer fab is about 321,000 square meters, roughly 1.5 times that of the first wafer fab.

In addition, the overall investment amount of the JASM's second wafer fab will reach 2.2 trillion yen (TapTechNews note: currently about 100.316 billion yuan). The Japanese government will provide 732 billion yen (currently about 33.378 billion yuan) in subsidies.

According to the schedule previously disclosed by TSMC, the JASM's second wafer fab will be put into operation by the end of 2027. The factory will have the quasi-advanced manufacturing process capacity of 6/7nm, which will greatly enhance the semiconductor mass production technology level in Japan.