TapTechNews May 16 news, Honda announced recently that it has signed a memorandum of understanding with IBM to jointly develop next-generation semiconductor and software technologies for 'Software Defined Vehicles (SDV)'.
Honda stated that the use of smart/artificial intelligence technology is expected to significantly accelerate throughout society starting in 2030, and SDVs using these technologies are expected to become mainstream in mobile travel. Compared to traditional mobile travel, SDVs are expected to significantly improve the required processing power and related power consumption, as well as the complexity of semiconductor design.
Both parties stated that in order to address these issues and achieve competitive SDVs, the ability to independently develop next-generation semiconductor and software technologies is necessary. With automakers competing in the field of autonomous driving and advanced driver-assistance systems, the demand for SDVs is expected to increase, according to the expectations of the cooperating parties.
TapTechNews learned from the statement that the memorandum of understanding identifies potential areas of joint research to significantly increase processing power and reduce power consumption. Honda stated that it will consider joint development of semiconductor technologies such as small chips. In terms of software technology, Honda's goal is to improve product performance and shorten development cycles by optimizing with hardware and exploring open and flexible software solutions.
Honda's statement mentioned that through this collaboration, the two companies aim to achieve SDVs with the world's highest processing speed and energy efficiency.