FroreSystems to Showcase cooling solutions at COMPUTEX 2024

TapTechNews May 30th, solid-state active cooling technology enterprise FroreSystems announced yesterday local time that it will participate in COMPUTEX 2024 which kicks off next month on the 4th to showcase multiple cooling solutions based on AirJet heat sinks.

FroreSystems also announced on the same day that the company has received $80 million (TapTechNews note: currently about 581 million yuan) in Series C financing. This funding will be used to enrich the AirJet product line, expand the scale of operations, and meet the rapidly growing demand for solid-state active cooling solutions.

FroreSystems will bring the AirJetPAK active cooling module for Nvidia's Jetson Orin edge AI system this time.

This series of modules contains multiple AirJet heat sinks and driving circuits, which can be directly installed on the Jetson Orin computing module to meet the needs of edge AI systems for a compact cooling solution that is dust-proof, quiet, and free of vibration.

The parameters of each version of AirJetPAK are as follows:

Model AirJetPAK5C-25 AirJetPAK3C-15 AirJetPAK2C-10Number of AirJets 5 3 2Heating dissipation capacity 25W 15W 10WApplicable system Jetson Orin NX5GB Jetson Orin Nano 8GB Jetson Orin Nano 4GBComputing power support 100 TOPS 70 TOPS 50 TOPS

In addition, FroreSystems will also showcase the RoughNeck rugged industrial tablet with four AirJetMini heat sinks.

This tablet from AcuraEmbeddedSystems is for harsh environments such as offshore oil and gas extraction and has an IP54 dust-proof and water-proof rating.

AirJetMini heat sink is based on the principle of thin film ultrasonic vibration and can draw in sufficient airflow from the dust filter of this tablet, which can improve the CPU performance by 20% even at an ambient temperature of 45°C.

COMPUTEX 2024 Special Topic