Samsung and SK Hynix Start Immersion Liquid Cooling Tests for Chip Products
TapTechNews, June 27th. According to Korean media ETNews citing sources, Samsung and SK Hynix have started compatibility tests of their chip products for immersion liquid cooling.
Immersion liquid cooling is a new cooling method for data centers, which immerses the server in a non-conductive immersion coolant for cooling, and then the coolant transfers the heat to the outside through a heat exchanger (single-phase) or a condenser tube (two-phase).
TapTechNews has learned that compared to traditional solutions, immersion liquid cooling can reduce the cooling energy consumption by 30% to 40%, and at the same time there is no fan on the server side, reducing the noise in the computer room. The immersion in the liquid also avoids the impact of external vibration and humidity on the server lifespan.
However, immersion liquid cooling also means that semiconductor components are in direct contact with the coolant, and it is necessary to test and verify whether there will be a chemical reaction between the semiconductor and the coolant and whether immersion in the coolant will affect performance.
The source said that to meet the demand of the server operator to establish an immersion liquid cooling solution warranty policy, Samsung Electronics and SK Hynix have begun to conduct semiconductor immersion liquid cooling compatibility tests and functional tests to understand the operation of their products in various immersion liquid cooling environments.
Samsung Electronics and SK Hynix will first test the already released products, establish an immersion liquid cooling test database, and refer to these data in the development of future products to launch semiconductor products that have been verified to be suitable for immersion liquid cooling.
Industry insiders said that the immersion liquid cooling with stronger heat dissipation ability may also have an impact on the future development of semiconductors: chips have stronger heat resistance in immersion liquid cooling, so it is possible to focus on developing chip products with higher performance and integration.