Samsung Electronics Announces Custom HBM and 48GB HBM4 Development

TapTechNews July 10th news, according to the reports of Korean media TheElec and ZDNETKorea, Samsung Electronics stated at the Samsung Foundry Forum & SAFE Forum 2024 in Seoul, South Korea yesterday that custom HBM is expected to become a reality in the HBM4 generation.

Samsung Electronics' head of the new business planning team in the storage division, Choi Jang-seok, said: We are seeing huge changes in the HBM architecture. Many of our customers are shifting from traditional general-purpose HBM to custom products.

He added: Custom HBM will provide different choices in PPA (TapTechNews note: Performance Performance, Power Power, and Area Area) from standard products and bring significant value.

Choi Jang-seok specifically introduced two possible forms of custom HBM:

Without using the interposer and base die that are necessary in the existing 2.5D packaging solution, directly 3D integrate the HBM chip on the computing SoC, which can simplify the data path from the computing chip to the HBM and reduce the power consumption and footprint of the chip, which is similar to the previously demonstrated SAINT-D;

Transfer the I/O interface and controller of the memory to the base die of the HBM memory to leave more space for the logic circuit for the computing chip.

Choi Jang-seok also mentioned that Samsung Electronics is developing a large-capacity HBM4 memory with a single stack up to 48GB, which is expected to go into production next year.