#memory#

Kefu's new FITV DDR5 memory with high compatibility and overclocking tech, coming in July 2024.

Memory giant Micron reports earnings, expects Windows 12 and HBM impacts on memory supply.

Samsung announces the establishment of the first CXL verification center and its significance in the industry.

Report on SK Hynix's progress in 3D DRAM technology and its comparison with Samsung's efforts.

Apple's new feature Predictive Code Completion in Xcode 16 requires at least 16GB memory, highlighting potential limitations for 8GB Macs. Article explores the implications.

News about AMD Ryzen Strix Halo mobile APU's new configuration, features like memory support and computing power.

Apple introduced its new AI system 'AppleIntelligence' at WWDC 2024 but with some limitations. Learn about the reasons and requirements for its use.

SK Hynix plans to increase 1bnm DRAM capacity to meet HBM3E demand, affects decision-making and related equipment.

The article reports on the growth of the DRAM memory industry in Q1 2024, with details on revenue, sales, and price changes, and the outlook for Q2.

Details about the Xiaomi 15 series including its specs, features, and possible price hike. Explore more.

Micron announces new GDDR7 graphics memory with high speed, bandwidth, and performance improvements.

GeIL launched various DDR5 solutions at the 2024 Computex Taipei, featuring high capacity and speed. Some products can be overclocked without cooling. These new memory products are expected in Q4 2024. TapTechNews to follow.

Patriot presents new memory and SSD products at 2024 Computex Taipei, including ViperXtreme5RGBDDR5MPower and ViperPV573 with high specs.

Kingston brings new memory and storage products with unique designs at Computex 2024 Taipei. Learn about their features and specs here.

Discover the latest trends in Steam's hardware survey, including memory usage shifts and the rise of non-Windows operating systems.

Samsung Electronics is gradually advancing the process upgrade of eMRAM memory, with the development of 8nm basically completed.

SK Hynix aims to integrate more functions in HBM4E memory, potentially transforming the industry. Learn more.

ADATA announces participation in Computex 2024 with various products and technologies, including gaming laptops, memory modules, storage devices, and gaming peripherals.

G.SKILL's new TridentZ5Royal DDR5 memory with unique design and features, supports XMP3.0. Capacity and price to be determined.

KLEVV and its parent Essencore to present various memory and SSD products at Taipei's COMPUTEX 2024.

G.SKILL announces new products and events at Computex 2024. Learn more here.

EK's new split water-cooling head for memory, with features and details.

iFixit has disassembled the 2024 13-inch iPad Pro, uncovering details about its memory configuration.

Jiangbolong, the parent company of Lexa, introduces the new FORESEELPCAMM2 memory module at CFMS2024, featuring LPDDR5/5x chips, high frequencies, and reduced power consumption for efficient performance.

Patriot Technology partners with MSI to launch the ViperXtreme5RGB DDR5 MPOWER series memory, offering high-speed performance with customizable RGB lighting and optimal overclocking capabilities.

Samsung Electronics' 8-layer stacked HBM3E memory faces verification challenges with Nvidia, TSMC involved in the process. Differences in testing standards between Samsung and SK Hynix may need adjustment for successful verification.