Google's Next-Year Flagship Smartphone's TensorG5 Chip Enters Tapeout Stage

TapTechNews July 1, it was reported by Taiwan media China Times that the TensorG5 chip expected to be used in Google's flagship smartphone next year will be based on TSMC's 3-nanometer process and has successfully entered the tapeout stage.

Tapeout is a critical stage before the official mass production of a chip, using a small-scale trial production of the chip to test whether the chip design is correct. For Google, which is the first to fully self-develop a mobile phone SoC, if it successfully passes the tapeout, it will be a big step closer to the success of TensorG5.

The full self-development of TensorG5 will mean that Google can complete the all-round control from the chip to the entire device and then to the operating system and even the application programs for Pixel devices, which helps to achieve a deeper software and hardware integration.

In the end, Google can deploy AI applications on its own devices more quickly, creating differentiated products and thus standing out in the highly competitive smartphone market.

According to TapTechNews' previous report, Google's TensorG5 chip code-named Laguna Beach will realize the stacking of SoC and DRAM through TSMC's InFo_PoP wafer-level fan-out packaging technology and support more than 16GB memory.

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