TapTechNews May 22nd news, according to foreign media Anandtech report, TSMC stated at the 2024 European Technology Forum held recently that the production capacity of two advanced packaging technologies, CoWoS and SoIC, will continue to grow rapidly by the end of 2026.
CoWoS is a 2.5D substrate packaging business and is the industry's mainstream HBM high-bandwidth memory chip and computing chip integration technology, which is widely used in products such as NVIDIA AIGPU.
TSMC plans to achieve a compound annual growth rate of 60% in CoWoS production capacity in the three years from the end of 2023 to the end of 2026, which means that the CoWoS production capacity at the end of 2026 will be about 4 times that at the end of 2023.
According to TapTechNews' report last month, TSMC is also actively expanding the细分 categories of CoWoS and plans to launch variants such as CoWoS-L with a larger overall area in the future.
In addition to TSMC itself, OAST enterprises such as ASE are also continuously expanding the production capacity of CoWoS-like packaging to meet market demand.
And SoIC is an advanced packaging technology that stacks chips or wafers onto another wafer and is used on AMD's 3D cache.
TSMC plans to achieve a 100% compound annual growth rate in SoIC production capacity in the three years from the end of 2023 to the end of 2026, which means that the SoIC production capacity at the end of 2026 will be about 8 times that at the end of 2023.
TSMC estimates that in the next few years, chip systems for applications such as AI and HPC will adopt both CoWoS and SoIC technologies.
TSMC will simultaneously increase the production capacity of these two advanced packaging technologies to meet the manufacturing needs of complex processors.