#SoIC#

Apple Expands Cooperation with TSMC on SoIC Packaging, Expected to Use in 2025
Apple and TSMC's cooperation in SoIC packaging, its details and differences from CoWoS, with expected applications. Less than 150 characters.
Emma·

TSMC to Rapidly Expand Advanced Packaging Capacities
TSMC plans to significantly increase the production capacity of CoWoS and SoIC by the end of 2026, impacting the semiconductor industry.
Maxwell·