Micron Expands HBM Memory Production Globally

TapTechNews June 20th. According to Nikkei Asia report, Micron is expanding or planning to expand the HBM memory production line at multiple global production bases, grabbing more lucrative orders from processor manufacturers in the AI boom.

Micron said its goal is to rapidly increase its market share in the HBM field market to about 20% by 2025, catching up with the share in its overall DRAM industry revenue.

For reference, according to data from the analysis agency TrendForce Group in March this year, Micron's capacity of HBM memory wafers last year only accounted for about 3% of the overall market.

According to the situation TapTechNews has learned, Micron's largest HBM memory production base is currently located in Taichung City, Taiwan Region, and it is increasing capacity at the Taichung plant.

Sources said that Micron is currently expanding the R & D and production facilities related to HBM at its headquarters in Boise, Idaho, USA, including the technical verification production line and the mass production line.

In addition, Micron is also considering building HBM production capacity in Malaysia for the first time. Micron currently has chip testing and assembly facilities in Malaysia, and the possible capacity building is also expected to focus on the back-end process part.

Data from Morgan Stanley shows that AI computing chip giant Nvidia is also the largest buyer of HBM memory and will purchase about 48% of the global HBM capacity this year.

Micron announced in February this year that its 8Hi 24GB HBM3E memory has entered the mass production stage and supplies to Nvidia's H200 chip. Micron claims that this memory has a 30% reduction in power consumption compared to competitors, which helps reduce the operating cost of data centers.