TSMC Begins Mass-Producing for Intel's LunarLake and ArrowLake

TapTechNews June 19. Sources at DigiTimes said that TSMC has begun to mass-produce the components (tiles) of LunarLake and ArrowLake for Intel on its 3nm EUV FinFET foundry node .

Unlike the single-chip processors of the 13th generation and earlier versions, the Intel CoreUltra family of processors uses a decomposable architecture to implement different components (named tiles or chiplets).

This means that each component can be individually fabricated using existing manufacturing techniques and then aggregated onto a substrate to construct the device.

Intel has determined to use TSMC's 3nm process node to produce the upcoming CoreUltra 300 LunarLake processor, which Intel has introduced at Computex Taipei 2024.

TapTechNews has previously published articles detailing the LunarLake mobile processor with 40% lower power consumption, 1.5 times the graphics performance, and 120 TOPS of AI computing power. Users interested can click to read.

The first batch of laptops with LunarLake mobile processors is expected to be on the shelves in the third quarter of 2024, and ArrowLake will go on the market in the fourth quarter.