Corning Releases New Generation Extreme ULE Glass for Chip Manufacturing

TapTechNews October 2nd news, Corning Incorporated today released a new generation of Extreme ULE glass material, and Corning will showcase this glass and other semiconductor materials at the SPIE Photomask Technology + Extreme Ultraviolet Lithography Conference held in Monterey, California from September 30th to October 3rd.

According to the introduction, this new glass material can help chip manufacturers improve the template photomask for chip design, can withstand the highest intensity of extreme ultraviolet (EUV) lithography, has a nearly zero expansion characteristic, and is applicable to EUV photomasks and lithography mirrors, which is crucial for the large-scale production of the most advanced and cost-effective microchips.

TapTechNews note: Photomask is the graphic masterplate used in the commonly used lithography process of micro-nano processing technology, which can etch very fine circuit patterns on the light-shielding film on the surface of the transparent glass plate, thereby replicating the patterns onto the wafer using lithography etching technology.

Corning said that EUV lithography requires manufacturers to use the most advanced photomasks to complete the patterning and printing process, and this process requires extreme thermal stability and uniform glass materials to ensure consistent manufacturing performance.

Claude Echahamian, senior vice president and general manager of Corning Advanced Optics, said, Extreme ULE glass enables higher power EUV manufacturing and higher yield, expanding Corning's key role in the continuous pursuit of Moore's Law.