TSMC's Chiayi Science Park Factories Resume Construction After Archaeological Discoveries

TapTechNews August 16th news, according to the United Daily News report yesterday (August 15th), after the suspension of construction due to archaeological discoveries, TSMC's two CoWoS packaging factories in the Chiayi Science Park have been re-approved to start construction.

TSMC plans to build two CoWoS packaging factories in Chiayi. The first factory will be completed in 2026 and put into production in 2028. However, during the construction process in May this year, some cultural relics were found, so the entire construction project was suspended.

TSMC entrusted an archaeological company and urgently recruited 60 archaeological excavation experts with a daily salary of NT$1,700 (TapTechNews note: currently about 376 RMB yuan), and the working hours are from 8 a.m. to 5 p.m., with 2 days off per week and cooperation with overtime to excavate and preserve relevant cultural relics.

The Taibao Farm site, the first factory of TSMC's Chiayi advanced packaging factory, is a rope-pattern pottery cultural site between 3,500 and 4,500 years ago. Rope-pattern pottery shards, pottery rings and other fragments, as well as ash pits and shell mounds were found during the excavation.

All unearthed cultural relics will be stored locally, and TSMC will provide a temporary warehouse. The subsequent further processing part will be handed over to the Department of Anthropology of National Taiwan University and the Southern Taiwan Science Park Administration, and will be transferred to the Chiayi County Cultural Affairs Bureau for preservation after the excavation is completed.

After review by the Chiayi Committee, TSMC has been approved to build the first and second phases of the advanced packaging and testing plant 7 (AP7).

The advanced packaging and testing plant 7 of TSMC will be equipped with advanced packaging technology equipment such as InFO and CoWoS. CoWoS-S is used for AMD Instinct MI250, NVIDIA A100/H100/H200; CoWoS-L is used for B100/B200 and the next-generation AI and HPC application processors.

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