AMD's

TapTechNews August 1st news, the source @7931doomer111 tweeted today (August 1st) sharing relevant information about AMD's StrixHalo Zen5 APU, showing that the graphic Die size equipped with RDNA3.5 is 307 square millimeters.

According to the exposed information, AMD's StrixHalo Zen5 APU adopts FP11 packaging, and the packaging area is 37.5 * 45 millimeters, which is the same as the LGA-1700 slot panel.

The information graph shows that the largest Die is the graphics module, which adopts RDNA3.5 graphics technology, and the area is at least 307 square millimeters, while the smaller Die is 2 CCDs (each providing 8 Zen5 cores), and the size is 66.3 square millimeters.

TapTechNews attached another exposed picture, which disclosed the thermal design data of AMD's StrixHalo Zen5 APU, including 55W, 85W and 120W (excluding memory power consumption). AMD estimates that the memory power consumption of a 32GB system is 9W, and the power consumption of a 128GB system is 13W.

Related reading:

AMD's StrixHalo FP11 packaging size exposed: comparable to Intel's LGA1700, 60% larger than Phoenix.