Jiangbolong Unveils FORESEELPCAMM2 Memory at CFMS2024

TechNews on May 16th, Jiangbolong, the parent company of Lexa, announced at CFMS2024 the new form of memory - FORESEELPCAMM2.

FORESEELPCAMM2 is equipped with LPDDR5/5x chips, compatible with 315ball and 496ball designs, supports frequencies of 7500MT/s and above, and offers capacities of 16GB, 32GB, and 64GB.

In terms of product process, FORESEELPCAMM2 adopts a new design architecture, directly encapsulating 4 x 32LPDDR5/5x memory chips on a compressed connector, achieving a 128-bit memory bus on a single memory module, providing a more efficient encapsulation process than standard memory modules. In addition, its PCB design has 10 layers, optimizing signal integrity (SI) and power integrity (PI) through self-developed PCB and following the JEDEC JESD318 standard.

Jiangbolong stated that compared to the conventional SODIMM form, the small form factor of FORESEELPCAMM2 (78×34×1.2mm) can save more than 60% of device space. The smaller form factor and dual-channel structure allow a single LPCAMM2 to replace two SODIMMs, and the saved space can be used for other components such as SSDs, GPUs, and batteries.

FORESEELPCAMM2 has also been further optimized for power consumption. Compared to SODIMM, the product also features a power management IC and voltage regulation circuit, but consumes nearly 50% less power, and energy efficiency is improved by nearly 70%.

TechNews learned from the official Jiangbolong website that FORESEELPCAMM2 has successfully passed initial tests including SPD, hardware, functionality, burning, Powercycle, performance, temperature, and compatibility. The team is currently conducting joint verification with multiple partners to address early application challenges.