SK Hynix to Tape Out HBM4 Memory for Nvidia and AMD in 2024

TapTechNews August 26th news, according to the report of South Korean media ZDNetKorea, SK Hynix will successively tape out the HBM4 memory developed for Nvidia and AMD, the two major customers, within 2024.

Insiders told the South Korean media that SK Hynix has formed HBM4 memory development teams for these two main HBM memory customers. Nvidia will tape out with HBM4 first in October this year, and the HBM4 to be supplied to AMD will also tape out by the end of this year.

The report also said that although Samsung Electronics plans to directly apply 1cnm DRAM on HBM4 memory to enhance energy efficiency competitiveness, SK Hynix will continue to use the 1bnm DRAM die that has been tested in HBM3E for stability.

In the base die (also known as logic chip or interface chip) part of HBM4, SK Hynix will adopt the N12FFC+ budget products and N5 high-performance products provided by TSMC.

In addition, the South Korean media mentioned that the high-performance AIGPU Rubin of the post-Blackwell generation that Nvidia is expected to release in 2026 will use 12-layer stacked HBM4 memory.

Referring to TapTechNews' previous report, Samsung Electronics, the main competitor of SK Hynix in the HBM field, will also start the tape out of HBM4 memory within 2024.