Foxconn Group Enters Advanced Packaging Field with Focus on FOPLP

TapTechNews July 11th news, The Economic Daily reported today (July 11th) that Foxconn Group has entered the advanced packaging field, focusing on the currently mainstream panel-level fan-out packaging (FOPLP) semiconductor solution.

After its subsidiary Innolux, Sharp, which is invested by Foxconn Group, also announced to enter the Japanese panel-level fan-out packaging field and is expected to start production in 2026.

Foxconn Group already has sufficient influence in the AI field, and filling the shortcoming of advanced packaging enables it to provide a one-stop service, which is convenient for accepting more AI product orders later.

TapTechNews queried public information, and Foxconn Group currently holds 10.5% of Sharp's equity, and the group said it will not increase or decrease its holdings at this stage, and will maintain the existing investment relationship.

Sharp announced that it will join hands with the Japanese electronic component manufacturer AoiElectronics to enter the advanced packaging field, and Aoi will renovate the existing Sharp factories and facilities and build semiconductor packaging production lines.

Aoi plans to build an advanced semiconductor panel packaging production line in the Sharp factory within 2024, with the goal of full production in 2026 and a monthly production capacity of 20,000 wafers.