Loongson中科's Next-Generation Desktop Processors 3B6600 and 3B7000

TapTechNews August 12th news, Loongson中科 is currently developing the next-generation desktop processor series 3B6600 and 3B7000. In an interview disclosed by the China Electronics News this month, Hu Weiwu, the chairman of Loongson中科, revealed more information about the new processor.

Hu Weiwu stated that the desktop CPU Loongson 3A6000 launched by Loongson in 2023, the measured performance is equivalent to the fourth-generation Core quad-core processor of Intel Corporation listed in 2020; the 16-core and 32-core versions of the Loongson 3C6000 server CPU successfully developed by Loongson this year, the performance is equivalent to Intel's Xeon 4314 and 6338.

Hu Weiwu previewed that the 3B6600 eight-core desktop CPU currently being developed by Loongson uses mature technology and it is expected that the single-core/multi-core performance can reach the level of mid-to-high-end Core generations 12-13 using advanced technology.

Hu Weiwu also disclosed that it is expected that by the end of 2024, Windows operating system and its applications can run relatively smoothly on Loongson's Linux platform.

According to TapTechNews' report in April this year, the Loongson中科 CPU roadmap shows that the next-generation Loongson desktop processor will integrate eight LA864 cores, the main frequency of 3B6600 is 3.0 GHz, and at the same time integrates the LG200 core display; the main frequency of 3B7000 can reach 3.5 GHz and has rich IO interfaces, including PCIe4, SATA3, USB3, GMAC and HDMI, etc.

Loongson中科's Next-Generation Desktop Processors 3B6600 and 3B7000_0

Hu Weiwu also once disclosed: 'In 2024, Loongson will tape out the first big-small core collaborative chip. The next generation of Loongson 3A6000 will be 3B6000, with eight cores of four big and four small, and a built-in self-developed GPGPU. The big core strives to further improve the performance by more than 20% through structural optimization (quite difficult). On the basis of 3B6000, more advanced technology will be used to develop 3A7000 or 3B7000, and the technical preparation work for more advanced technology will be carried out in the second half of the year (since Loongson insists on self-developed IP and needs to customize the PHY such as memory interface and PCIE interface, which takes approximately one year).'

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