TapTechNews May 27th. According to the announcement of the US Department of Commerce on the 23rd of this month, the US government has reached a non-binding preliminary term memorandum with the glass substrate enterprise Absolics.
According to the memorandum, Absolics is expected to receive direct financial support of up to 75 million US dollars (TapTechNews note: currently about 545 million yuan) from the US Chips and Science Act.
Absolics has also become the first enterprise in the advanced semiconductor material manufacturing field to obtain funds from the US Chip Act.
The funds provided by the US government will be used for the construction of Absolics' 120,000-square-foot (about 11,148 square meters) glass substrate factory located in Covington, Georgia, USA, and the development of advanced packaging technology for glass substrates for semiconductors.
Glass substrates can achieve smaller and more densely packaged, while reducing the connection length, thereby reducing the power consumption and system complexity of AI, HPC, and data center chips, and ultimately achieving faster and more energy-efficient computing.
Absolics is a subsidiary of SKC, a subsidiary of the South Korean SK Consortium, and the leading application materials in the semiconductor equipment field also holds a certain number of shares in this enterprise.
The press release stated that this proposed investment will bring about 200 manufacturing and R & D positions and more than 1,000 construction job opportunities to the local area of Covington, and at the same time will strengthen the 3D packaging research cooperation between Absolics and the Georgia Institute of Technology.
In addition, Absolics will also cooperate with the RF Technology Department of the US Department of Defense on the latter's most advanced heterogeneous integrated packaging project, and provide skills training and practical education to the Piedmont Technical College in Georgia.