According to TapTechNews on June 14, TapTechNews learned from the official WeChat public account of the Zhengzhou Airport Economy Zone in Henan that Zhengzhou Hejing Silicon Materials Co., Ltd. (hereinafter referred to as Zhengzhou Hejing) has achieved mass production of high-purity monocrystalline silicon.
The person in charge of Zhengzhou Hejing introduced that the silicon wafer production mainly consists of two processes. One is to melt the raw materials, plant the seed crystal, and pull out a cylindrical single-crystalline silicon ingot; the other is to cut the silicon ingot into silicon wafers with uniform thickness, and then go through more than 20 processes such as grinding and polishing to finally make the single-crystalline silicon polished wafer which is the carrier of the chip.
The person in charge said that the quality of the silicon wafers produced has ranked among the forefront of the international advanced level, and the products have been recognized by global leading silicon wafer suppliers such as SMIC, TSMC, and China Resources Microelectronics.
Zhengzhou Hejing is promoting the small-batch production of 12-inch large silicon wafers and has successfully attracted orders from global leading silicon wafer suppliers. Some orders have been scheduled until 2026.
Taking the 5-nanometer chip as an example, compared with the 8-inch silicon wafer, a 12-inch silicon wafer can cut out more than 300 more chips, thereby greatly improving production efficiency. The company operates non-stop 24 hours a day, and the annual production capacity will reach 1.8 million pieces.