TapTechNews July 4th news. Today, TechInsights released a report stating that with the gradual recovery of the memory market and enterprises actively preparing for the upcoming peak sales season, the utilization rate of semiconductor manufacturing plants has emerged from last year's trough and is expected to exceed 80% in the second half of 2024. The capacity utilization rate of TSMC's 5-nanometer and below advanced processes has nearly reached saturation. At the same time, there are reports that NAND flash memory manufacturers are also about to end the production reduction measures.
The report mentioned that the situation in the industrial and automotive markets remains unclear. Due to stalled market demand, manufacturers in fields such as analog chips and discrete devices were forced to cut production in the first half of 2024. Therefore, compared to cutting-edge technology nodes, the wafer fab utilization rate in mature technology nodes is not ideal. But this situation is only temporary, and it is expected that the demand in this field will pick up somewhat in the second half of 2024 as inventories are gradually digested.
Looking ahead, the report said that with the full recovery of terminal demand, the global wafer fab utilization rate is expected to increase to about 80% in the second half of 2024 and reach an average utilization rate of 90% in 2025.
TapTechNews noted that there was previously news that TSMC is preparing to announce a price increase starting from January 1 next year, mainly for 3/5 nm, while other processes remain at the original price.
TSMC President Wei Zhejia also emphasized that TSMC's process is very power-saving, and the yield is relatively good. In terms of each die, TSMC is the cheapest and promised quarterly progress and annual improvement, always providing customers with the most advanced technology.