SK Hynix's 3D DRAM Technology Update

TapTechNews June 24 news, according to South Korean media BusinessKorea report, industry insiders disclosed that SK Hynix presented the latest research paper on 3D DRAM technology at the VLSI2024 summit held in Hawaii, USA from June 16 to 20.

In this paper, SK Hynix reported that the yield rate of its five-layer stacked 3D DRAM memory has reached 56.1%, and the 3D DRAM in the experiment showed similar characteristics to the current 2D DRAM.

It is introduced that, different from the horizontal arrangement of memory cells in traditional DRAM, 3D DRAM vertically stacks cells, which can achieve higher density in the same space.

However, SK Hynix pointed out that, different from the stable operation of 2D DRAM, 3D DRAM shows unstable performance characteristics, and it needs to stack 32 to 192 storage units to achieve widespread application.

TapTechNews noted that Samsung is developing 16-layer stacked 3D DRAM and announced at the MemCon2024 exhibition in March this year that it plans to commercialize 3D DRAM products around 2030.