TapTechNews August 6th news, Yang Zhuxiang, the general manager of Innolux Corporation, said yesterday (August 5th) that the company is actively laying out and promoting the Fan-out Panel-level Packaging (FOPLP) for semiconductors, and it is expected to mass-produce the ChipFirst process technology by the end of this year, and the contribution to revenue will appear in the first quarter of next year.
Innolux Corporation stated that it is expected to mass-produce the Redistribution Layer (RDLFirst) process technology for mid-to-high-end products within the next 1-2 years, and will work with partners to develop the most technically challenging Through Glass Via (TGV) process, which will still take 2-3 years to put into mass production.
Yang Zhuxiang said that Innolux's FOPLP technology is ready for mass production, and will enter the market from mid-to-low-end products and gradually expand to mid-to-high-end products in the future.