Samsung Starts Mass Production of Thinnest LPDDR5X Memory Package

TapTechNews August 6th news, Samsung Electronics today announced the start of mass production of the industry's thinnest LPDDR5X memory package. The new product has a package height of 0.65mm, reducing by about 9% compared to the 0.71mm of the previous-generation product, and the heat resistance performance has increased by 21.2%.

Samsung Electronics' newly launched LPDDR5X memory package is based on 12nm-class LPDDR DRAM and adopts a 4-stack and 2-layer structure design per stack, offering two capacity versions of 12GB and 16GB.

In the process of manufacturing this memory package, Samsung Electronics optimized the PCB and epoxy molding compound (TapTechNews note: Epoxy Molding Compound, abbreviated as EMC) technology, and combined with the wafer back grinding process to make it the thinnest LPDDR DRAM module with a capacity of 12GB and above.

The lower package height, combined with better heat resistance, can provide more ventilation space for mobile devices, thereby improving the overall heat dissipation effect of the equipment, and finally achieving a better performance in high-load device-side generative AI applications.

Samsung Electronics' Vice President of Memory Product Planning, Bae YongCheol, said:

Samsung's LPDDR5X DRAM has set a new standard for high-performance device-side AI solutions, not only providing excellent LPDDR performance but also achieving advanced thermal management in an ultra-compact package.

We are committed to continuous innovation through close cooperation with customers to provide solutions that meet the future needs of the LPDRAM market.

Samsung Electronics plans to expand the ultra-thin LPDDR DRAM memory package to 6-stack 24GB and 8-stack 32GB modules in the future.